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|()Table_Summary Bump RDL Wafer TSV TSV WLP 2.5D/3D SiP Yole 2021-2027 9.6%3D Chiplet Chiplet Chiplet 3D Fabric VIPack TSV 2.5D/3D SiP 1 2 Chiplet Chiplet 3 300 M2 Ultra Vision Pro AI LED:-20%-15%-10%-5%0%5%10%15%20%电子 沪深300|2 25$start$1.4.2.10.3.13.4.18.5.24 6.24.0YDWwPtOsRrQrPoNqNoRoP6M9R7NpNnNnPtQiNmMqOjMnMpNbRnNxPNZmQqQwMmOzR|3 25.|4 25 1 1.1 1.5-2 IBS 16nm 10nm 10 30.7%7nm 5nm 17.8%5nm 3nm 4.2%1:(mm2)()/($)($)10($)International Business Strategies 3nm 1nm 1nm 2 a=0.5nm 2:SiP SiP(System in Package,SiP)|5 25 3:International Roadmap for Devices and Systems 1.2 4 1990 DIP SOP LCC 1990 2000 BGA CSP FC 2000 2.5D/3D HDAP High Density Advanced Package 4:1 2 3 4 1 2 PCB|6 25 5:1.3 Bump RDL Wafer TSV 1 Bump Flip-Chip Hybrid Bonding 2 RDL X Y I/O WLP 2.5D/3D Flip-Chip 3 Wafer WLP 2.5D Wafer 4 TSV Z 6:SiP RDL TSV X-Y-Z RDL X-Y WLCSP FOWLP INFO FOPLP EMIB TSV Z 2.5D 3D CoWoS HBM Co-EMIB HMC Wide-IO Foveros SoIC X-Cube|7 25 7:SiP WLP SiP 2.5D/3D WLP WLP Fan-in Fan-out Fan-out INFO FOWLP FOPLP 8:Flip-Chip FOWLP INFO FOPLP EMIB 2 CoWoS 2 HBM HMC|8 25 Wide-IO Foveros Co-EMIB SoIC X-Cube SiP 2D 2.5D 3D 9:FOWLP CoWoS HMC Wide-IO HBM INFO FOPLP EMIB Foveros Co-EMIB X-Cube TSMC-SoIC SiP SiP SiP CSP SiP SiP|9 25 Wire Bonding Flip Chip SiP SiP Chiplet/Chip Chiplet/Chip 2.5D 3D 10:SiP Chiplet Chiplet Die 2.5D 3D Chiplet SoC Chiplet IP IP Chiplet IP 11:SiP 3D Chiplet Chiplet 3D Chiplet AMD 2021 6 3D TSV Chiplet no Bump 3D Chiplet SoIC 3D V-Cache 64MB L3 Cache Chiplet 3D|10 25 12:SiP 2 2.1 Yole 2021 844 44%374 Yole 2027 1221 650 53%2021-2027 9.6%13:14:Yole Yole Frost&Sullivan 2020 351.3 2025 1,136.6 2020-2025 26.47%Yole 9.6%|11 25 15:Frost&Sullivan 3D 3D Flip-chip WLCSP ED 3D Yole 2020-2026 25%22%15%16:Yole 2.2 1|12 25 2 Chiplet Chiplet 17:IC RDL Bumping TSV TSV 18:RDL Bumping WLP Fan-out TSV C2W W2W WLP/CSP WLP/CSP BGA CSP 3D SiP BGA CSP 3D SiP|13 25 19:Gartner,3 3.1 HPC 2022 Q1 HPC 5G AI 2022 Q1 HPC 20:TSMC IDC 2026 1271.4EFLOPS 2022-2026 47.58%|14 25 21:IDC 3.2 AI AI TrendForce AI+AI 2023 38.4%2022-2026 AI 22%22:TrendForce AI Heterogeneous Computing CPU GPU FPGA DSP CPU GPU FPGA DSP CPU+GPU/FPGA/DSP CPU GPU/FPGA/DSP|15 25 23:SiP Heterogeneous Integration 24:SiP 2023 5 H30 12nm 256TOPS Int8 1.5ns 30-150 TOPS/W 3 H30 AI IPU Intelligence Processing Unit 8nm Resnet50 H30 2|16 25 25:3.3 Chiplet Chiplet AI Chiplet Chiplet Chiplet Omdia 5G 2035 Chiplet 570 2018-2035 30.16%26:SiP SoC Chiplet SoC Chiplet Chiplet IP Chiplet SiP XPU+DRAM|17 25 27:AMD Chiplet Chiplet 7nm 14nm 28nm 7nm AMD 7nm+14nm Chiplet 7nm AMD Chiplet Chiplet Chiplet 28:SiP Chiplet Chiplet IP 2023 2 Chiplet 12nm HUB Chiplet RISC-V CPU NPU Side Die 8-20TOPS INT8 AI|18 25 29:4 4.1 Yole 2021 119 35 Foveros EMIB 30.5 15 20 OSAT 6 7 30:Yole IC Foveros Co-emib ODI Foveros|19 25 31:SiP 3D Fabric 2.5D 3D 3D Fabric 2.5D CoWoS InFO 3D 3D SoIC 3D SoIC InFO-3D 2D/2.5D InFO 2.5D CoWoS CoWoS-S 3 8 HBM2e 128GB TSV 3 20 32:VIPack RDL Fan Out Package-on-Package FOPoP Fan Out Chip-on-Substrate FOCoS Fan Out Chip-on-Substrate-Bridge FOCoS-Bridge Fan Out System-in-Package FOSiP TSV 2.5D/3D IC Co-Packaged Optics RDL 2.5D/3D FOPoP 2023 3 14 3 8|20 25 33:ASE TSV 2.5D/3D Foveros CoWoS SiP VIPack FOSiP OSAT 4.2 OSAT OSAT 2022 OSAT Outsourced Semiconductor Assembly and Test OSAT 34:1 1 12325 2.9%28.4%5.6%2 2 7091.6 15.5%18.8%2.1%3 3 4990 5.4%17.1%3.9%4 5 3160 28.8%13.9%6.2%5 4 2786-7.1%20.8%2.9%6 6 1765-5.9%16.9%5.9%7 8 1221 1.1%35.6%3.4%8 10 800-17.4%32.7%3.2%9 9 784-20.0%21.0%4.9%|21 25 HANA 10 13 690 19.6%19.3%3.6%11 12 621 3.9%29.6%2.3%SFA 12 15 539-2.5%11.4%0.3%13 11 532-23.6%26.7%1.6%14 16 526-3.0%17.3%-15 14 516-9.6%16.3%2.2%16 19 479 12.4%40.7%3.6%17 17 467-6.7%35.5%2.6%LB Semicon 18 18 405-5.5%17.3%0.7%19 23 347 14.6%17.6%12.6%20 21 346-2.6%21.0%1.6%21 20 335-10.4%30.4%-22 22 323 1.4%22.0%5.6%23 24 315 8.3%8.8%0.5%24 25 303 5.1%13.4%2.1%AOI 25 26 302 5.1%12.4%0.0%26 28 256-6.6%37.0%4.2%Signetics 27 29 222-4.6%6.7%1.5%28 27 200-27.6%8.9%2.8%29 32 175 14.6%12.1%5.9%30 31 173 1.7%24.0%1.0%31 30 164-24.8%44.4%17.2%24.55%44%35:2.5D/3D(FIWLP)(FOWLP)(IPD)|22 25(TSV)(ECP)(RFID)SiP EMI LAB EMI 2.5D/3D 36:AMD 2022 12 31 1,383 70%2.5D/3D Chiplet 7nm Chiplet AMD 80%AMD 37:3D-Matrix SiP FC TSV Bumping Fan-Out WLP 3D Fan-Out-eSiFO embedded Silicon Fan-Out 8 12 3D FO SiP TSV eSiFo 3D SiP 3D Matrix 2.5D Interposer RDL+Micro Bump UHDFO FOPLP FCBGA|23 25 38:2017 11 QFN/DFN WB-LGA WB-BGA Hybrid-BGA FC-LGA SiP FC/QFN/DFN 39:TSV 8 12 CIS TOF MEMS STACK CIS|24 25 40:5 1 2 Chiplet Chiplet Chiplet IP Chiplet Chiplet 3 6|25 25$end$Table_InudstryRankInfo 6 10 6 10-10 6 10 Table_StockRankInfo 6 15 6 5 15 6-5 5 6 5 300 Table_RiskInfo Table_PromiseInfo Tale_ReliefInfo Table_AdressInfo 1528 28 2007 11
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