资源描述
S0740521120002 S0740521120001 S0740522120002 2024 7 28 AI 24Q2 1 24Q2&2XVEVuNrMpMnMoQoNmRtMnM6M9R6MtRmMoMmQjMoOvNeRqQmN7NrRxOvPpOuMMYrRvM24Q2 3 24Q2 1402.38 YoY+2.9%QoQ+5.6%16.4%YoY+0.4pcts QoQ+0.7pcts 77.83 YoY+0.6%QoQ+37%1 766.76 YoY+1.9%QoQ+5.2%22.1%YoY+0.9pcts QoQ+1.1pcts 2 628.52 YoY+4.1%QoQ+5.9%9.6%YoY+0.3pcts QoQ+0.3pcts Q3 24Q3 23%-23.5%24Q3 15%-20%24Q2 YoY QoQ 1402.38 2.9%5.6%-54.7%-0.5pcts-0.2pcts-44.8%+0.5pcts+0.1pcts-16.4%+0.4pcts+0.7pcts-77.83 0.6%37.0%-766.76 1.9%5.2%22.10%+0.9pcts+1.1pcts-628.53 4.1%5.9%9.60%+0.3pcts+0.3pcts-4 24/25 2.5 24 2.5%5%25 Q3 65%+Q2 60%Q3 65%24 Q3 300mm 300mm 600mm 600mm 25Q2 NXB41GfLG6FmcILdyXFbA/C4iNkD3XJlIbfvIKRvuXJ8sLOIgmulSaUxvVHvNwZW 24Q2 5 Wind 0%5%10%15%20%25%-100%-50%0%50%100%150%200%250%020040060080010001200140016001800200019Q319Q420Q120Q220Q320Q421Q121Q221Q321Q422Q122Q222Q322Q423Q123Q223Q323Q424Q124Q2()6 24Q2 49%-3pcts 19%+1pcts+1pcts 32%-1pcts+2pcts 24Q2Bump/FC/WLP/SiP 44%+3pcts+1pcts 31%-3pcts+1pcts 24Q2Bump/FC/WLP/SiP 21Q1 37%24Q2 44%0%20%40%60%80%100%21Q1 21Q2 21Q3 21Q4 22Q1 22Q2 22Q3 22Q4 23Q1 23Q2 23Q3 23Q4 24Q1 24Q2 0%10%20%30%40%50%60%70%80%90%100%21Q121Q221Q321Q422Q122Q222Q322Q423Q123Q223Q323Q424Q124Q2Bump/FC/WLP/SiP 7 24Q2 33%-1pcts-1pcts 11%+3pcts-1pcts 29%-4pcts+2pcts 13%-2pcts+1pcts 11%+3pcts-1pcts 0%20%40%60%80%100%21Q1 21Q2 21Q3 21Q4 22Q1 22Q2 22Q3 22Q4 23Q1 23Q2 23Q3 23Q4 24Q1 24Q2 24Q2 8 24Q2 406 94.3%78.1%53%38%1%EMS 8%CoWoS-80%-60%-40%-20%0%20%40%60%80%100%120%010020030040050060021Q1 21Q2 21Q3 21Q4 22Q1 22Q2 22Q3 22Q4 23Q1 23Q2 23Q3 23Q4 24Q1 24Q2 YoY QoQ 24Q2&9 10 Wind 2024 5 491.5 19.4%4.1%2023 11 7-30%-20%-10%0%10%20%30%01002003004005006002010-012010-062010-112011-042011-092012-022012-072012-122013-052013-102014-032014-082015-012015-062015-112016-042016-092017-022017-072017-122018-052018-102019-032019-082020-012020-062020-112021-042021-092022-022022-072022-122023-052023-102024-03 YoY QoQ 11 Yole 2026 5G Yole 2022 815 2026 961 2022 367 2026 522 22 45%54%2021-2026E 777815822899943961321 367 402 440 471 522 0%10%20%30%40%50%60%0200400600800100012002021 2022E 2023E 2024E 2025E 2026E全球封测产业规模（左轴，亿美元）先进封装市场规模（左轴，亿美元）全球封测产业规模YoY（右轴，%）先进封装市场规模YoY（右轴，%）先进封装占比（右轴，%）12 13 Yole 2021-2023 0510152025303540452021 2022 2023 Yole 2023 32/32/18/12.5 27%/27%/15%/10%,2D 2.5D 3D 3D+2D 3D+2.5D 61025 25 25 25303640 40100130150300050100150200250300350bump pitch size(m)Bump pitch size 14 VIPack VIPack VIPack 3D RDL 2.5D/3D 15 FOPoP FOPoP RDL RDL FOCoS BGA RDL D2D BGA FOCoS-Bridge RDL FOCoS-Bridge 2.5D 2.5D FOCoS-Bridge FOCoS 16 SiP SiP SiP SiP RDL 5 3 IOT 2.5/3D 2.5D 3D IC L/S 0.4/0.4m I/O 400 bu m p s/mm I/O CPU AP IC Co-Packaged Optics I/O HPC AI ML 2.5/3D 24Q2&17 18 1 2 3 AI 4 19
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